Company Profile / History /
Services Provided

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Company Profile

Trade Name EPI Co., Ltd.
Established April 1988
Capital 10,000,000 yen
Representative Representative Director Yasushi Azuchi
Banks Bank of Kyoto Kuse Branch, MUFG Bank Toji Branch , Kyoto Chuo Shinkin Bank Koga Branch
Affiliations Kyoto Industrial Association, Japan Institute of Invention and Innovation, Kyoto Industrial Support Organization 21, Kyoto Electronic Equipment Industrial Association

Company History

Apr 1988 Capital of 5,000,000 yen. Established as a corporation. Kameoka Office begins operation.
Jan 1990 Increased capital to 10,000,000 yen.
Aug 1992 Kyoto Sales Office opens and begins sales of electronic components.
May 1995 Began production and sales of taping machines.
Oct 1996 Began development, production, and sales of peeling testers.
Nov 1996 Began full-scale manufacturing operations for taping services.
Feb 1997 New building added to Kameoka Office.
Feb 1999 Developed a press taping machine and introduced it into the production line.
Oct 1999 Introduced embossed molding machines for integrated production from embossing to taping.
Apr 2000 Obtained ISO 9002 certification.
Jun 2000 Certified under the Provisional Measures Act on the Promotion of Creative Business Activities of Small and Medium-sized Enterprises.
Apr 2001 Kameoka No. 2 Plant completed
Apr 2002 Began development, manufacturing, and sales of embossing molding machines.
Apr 2003 Developed and introduced insert resin molding machines
Oct 2003 Transitioned to ISO 9001 (2000 version)
Jan 2005 Technical Center completed
Mar 2005 Obtained ISO 14001 certification
Jun 2005 Installed clean rooms
Jun 2007 Kameoka Oi Plant completed
Feb 2008 Moved the Kyoto Sales Office to Nagaokakyo City, Kyoto
Apr 2010 Hokuriku Sales Office established
Jun 2016 Yasushi Azuchi appointed as Representative Director
Jan 2017 ISO: 9001/14001 (transitioned to 2015 version)

Services Provided

1. Embossed taping processing for various parts (taping services)
2. Development, manufacture, and sales of taping machines, peel strength testers, and embossing machines
3. Development, manufacture, and sales of electronic component assembly equipment and image inspection equipment
4. Sales of various electronic components
5. OEM production of various electronic components
6. Development, manufacture, and sales of small stamped parts, resin molded parts, and insert molded parts